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Two component boron nitride filled epoxy, noted for its high thermal conductivity and robust bondability. Perfect for applications demanding efficient heat dissipation, it cures at room temperature and ensures strong bonds.
CHARACTERISTICS
- High thermal conductivity: Provides efficient heat transfer (1.0-1.3 W/m-K), optimising the thermal performance of electronic components. - Robust adhesion: Achieves shear strength up to 4000 PSI and 45 PIW on aluminium, ensuring durable and reliable bonds.
- Optimised viscosity: Allows for uniform and precise filling, ideal for potting and thin bond lines. - Cures at room temperature: Achieves initial strength in 4-8 hours without the need for external heat, speeding up production processes.
- Flexibility of fit: Initial tack allows repositioning of parts prior to curing, facilitating assembly.
- Excellent multi-surface adhesion: Adapts to metals, ceramics and plastics, ensuring firm and efficient contact.
- Superior resistance: Withstands thermal cycling, vibration and mechanical stress, offering durability in demanding environments.
APPLICATIONS
- Electronics: Perfect for fixing heat sinks, LEDs and electronic circuits, improving thermal management in high performance devices. - Automotive: Ideal for electronic systems in electric and traditional vehicles, where thermal conductivity and resistance are essential.
- Renewable energy: Used in solar panels and batteries, ensuring effective heat dissipation and secure joints.
- Protective potting: Its low viscosity allows it to fill gaps and protect sensitive electronic components with precision.
- Industrial applications: Joins metals, composites and various substrates in assemblies requiring high adhesion and thermal transfer.
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