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Two component boron nitride filled epoxy, noted for its high thermal conductivity and robust bondability. Perfect for applications demanding efficient heat dissipation, it cures at room temperature and ensures strong bonds.
CHARACTERISTICS
- Excellent thermal transfer: Provides a conductivity of 1.0-1.4 W/m-K, optimising heat dissipation in electronic components. - High bond strength: Offers a shear strength of 4500 PSI and 50 PIW on aluminium, ensuring strong bonds.
- Reduced viscosity: Facilitates potting and gap filling, allowing fine bond lines.
- Cures without external heat: Achieves initial strength in 4-6 hours at room temperature, speeding up processes.
- Low ion and gas emission: Minimises impurities and outgassing, ideal for sensitive electronic applications.
- Light initial tack: Allows for pre-cure adjustments, facilitating assembly.
- Optimal wetting: Improves adhesion to various materials, ensuring efficient contact. - High durability: Resists thermal cycling and mechanical stresses, ensuring long-term reliability.
APPLICATIONS
- Electronics: Joining heat sinks, transistors and heat generating components, optimising thermal management in devices.
- Automotive: Use in vehicle electronic systems requiring high thermal conductivity and resistance.
- Aerospace industry: Use in components that need to withstand extreme conditions and maintain thermal conductivity.
- Component encapsulation: Perfect for protecting sensitive electronics by gap filling, due to its low viscosity.
- Industrial assemblies: Ideal for bonding metals, ceramics and other substrates in applications requiring high adhesion and heat dissipation.
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